Title :
Practical application of fine pitch component mounting with precoat soldering
Author :
Amano, Toshiaki ; Shiroishi, Hirokazu ; Kohno, Masanao ; Obara, Yuichi
Author_Institution :
Furukawa Electric Co., Ltd., Hiratsuka, Japan
Abstract :
By combining the key capability of Super Solder precoat to supply high volumes of solder with the new pad geometry, major improvements are demonstrated in volume production mountability and mounting reliability for fine pitch components. In particular, a solder precoat supporting repair of a 0.3 mm pitch tape automated bonding (TAB) components is possible. A pad design permitting reflow mounting of quad flatpack (QFP) packages is discussed
Keywords :
fine-pitch technology; lead bonding; packaging; reflow soldering; surface mount technology; tape automated bonding; PWB; SMT; Super Solder precoat; TAB components repair; fine pitch component mounting; mounting reliability; pad design; pad geometry; precoat soldering; quad flatpack packages; reflow mounting; volume production mountability; Bridges; Chemical technology; Electronics packaging; Laboratories; Lattices; Lead; Production; Semiconductor device packaging; Soldering; Tin;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993, Fifteenth IEEE/CHMT International
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-1424-7
DOI :
10.1109/IEMT.1993.398226
