Title :
A modular 550 watt, 25 watts per cubic inch power supply for next generation aircraft
Author :
Holley, O.M. ; Bieschke, Bob
Author_Institution :
Texas Instrum., Dallas, TX, USA
Abstract :
The development of the HVS-550 high-performance power supply is described. The HVS-550 was designed and built utilizing surface mount construction, low profile magnetics, and aggressive thermal management techniques. This combination allowed the module height to be only 0.58 inch. The unique requirements of a military system which bound the power supply parameters are also discussed. The HVS-550 power supply is rated for delivered power of 550 W with a power density of 25 W per cubic inch. Cooling is provided either by liquid circulating through the chassis or by conduction through the card edges. The measured power supply efficiency is in excess of 85% with 11 V output. The output noise spectrum is excellent because of noise canceling techniques utilized to achieve the level of performance required by the system. This power supply is an evolutionary natural advance in technology based upon the proven SEM-E size 6 modules such as the full military HVS-200
Keywords :
aircraft; military systems; modules; power supplies to apparatus; 0.58 inch; 11 V; 550 W; 85 percent; HVS-550; SEM-E size 6 modules; cooling; low profile magnetics; military system; module height; next generation aircraft; noise canceling; output noise spectrum; power electronics; power supply; surface mount construction; thermal management; Aerospace electronics; Circuits; Instruments; Jamming; MMICs; Military aircraft; Military computing; Noise cancellation; Power supplies; Radar signal processing;
Conference_Titel :
Aerospace and Electronics Conference, 1990. NAECON 1990., Proceedings of the IEEE 1990 National
Conference_Location :
Dayton, OH
DOI :
10.1109/NAECON.1990.112805
