DocumentCode
2672376
Title
Chip Level IMPATT Combining at 40 GHz
Author
Rucker, C.T. ; Amoss, J.W. ; Hill, G.N.
fYear
1981
fDate
15-19 June 1981
Firstpage
347
Lastpage
348
Abstract
Results with series and series-parallel connections of CW40 GHz GaAs IMPATT diodes are discussed. The multichip geometries utilize Raytheon CW double-drift device chips and are essentially scaled versions of successful X-band geometries reported previously. Maximum series combining efficiency of 82 percent has been achieved.
Keywords
Capacitors; Circuits; Degradation; Diodes; Fixtures; Frequency; Gallium arsenide; Geometry; Impedance; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1981 IEEE MTT-S International
Conference_Location
Los Angeles, CA, USA
ISSN
0149-645X
Type
conf
DOI
10.1109/MWSYM.1981.1129920
Filename
1129920
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