DocumentCode :
2673021
Title :
Noise study method of soldering joints
Author :
Hajdu, I. ; Kineses, Zoltan ; Krammer, O.
Author_Institution :
Budapest Univ. of Technol. & Econ., Budapest
fYear :
2006
fDate :
10-14 May 2006
Firstpage :
296
Lastpage :
298
Abstract :
Formerly we have studied the noise of different electronic components (e.g. thick film resistors, polymer conductive layers, compound semiconductors, thin film layers). Now we concentrate on soldering technology. The contacts should have low resistance, low noise and high stability in time. Recently we try to find a noise measurement method to qualify the soldering joints. The measurement of noise is not very easy. We need an appropriate setup, a low-noise amplifier, separated source of energy for the circuit, isolation of other interfering signals from the environment. Since the noise of a contact is typically low, we also have to separate the contact noise from other noise sources in the circuits. Because the contact noise is still low, it is recommended to use several contacts in a serial line of connection. We also have to use multi-contacts, instead of a long soldering tube, since we want to investigate the contacts, not only the soldering materials. Basically we want to study three kinds of joints: carefully made, careless made, and damaged.
Keywords :
electric noise measurement; electrical contacts; soldering; carefully made soldering joint; careless made soldering joint; contact noise; damaged soldering joint; multicontacts soldering joint; noise measurement; noise study method; Circuit noise; Conductive films; Electronic components; Noise measurement; Polymer films; Resistors; Semiconductor device noise; Soldering; Thick films; Working environment noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on
Conference_Location :
St. Marienthal
Print_ISBN :
1-4244-0551-3
Electronic_ISBN :
1-4244-0551-3
Type :
conf
DOI :
10.1109/ISSE.2006.365116
Filename :
4216046
Link To Document :
بازگشت