• DocumentCode
    26747
  • Title

    Temperature-Stable Silicon Oxide (SilOx) Micromechanical Resonators

  • Author

    Tabrizian, Roozbeh ; Casinovi, G. ; Ayazi, Farrokh

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    60
  • Issue
    8
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    2656
  • Lastpage
    2663
  • Abstract
    This paper presents a passive temperature compensation technique that can provide full cancellation of the linear temperature coefficient of frequency (TCF1) in silicon resonators. A uniformly distributed matrix of silicon dioxide pillars is embedded inside the silicon substrate to form a homogenous composite silicon oxide platform (SilOx) with nearly perfect temperature-compensated stiffness moduli. This composite platform enables the implementation of temperature-stable microresonators operating in any desired in- and out-of-plane resonance modes. Full compensation of TCF1 is achieved for extensional and shear modes of SilOx resonators resulting in a quadratic temperature characteristic with an overall frequency drift as low as 83 ppm over the industrial temperature range ( -40°C to 80°C). Besides a 40 times reduction in temperature-induced frequency drift in this range, SilOx resonators exhibit improved temperature stability of Q compared with their single crystal silicon counterparts.
  • Keywords
    compensation; micromechanical resonators; silicon compounds; SiO2; composite platform; extensional mode; homogenous composite silicon oxide platform; in-of-plane resonance mode; linear temperature coefficient of frequency; microresonator; out-of-plane resonance mode; passive temperature compensation; quadratic temperature characteristic; shear mode; silicon dioxide pillar; silicon oxide micromechanical resonator; silicon substrate; temperature -40 C to 80 C; temperature stability; temperature-compensated stiffness moduli; uniformly distributed matrix; Acoustics; Frequency measurement; Resonant frequency; Silicon; Temperature distribution; Temperature measurement; High quality factor; homogenous composite; low insertion loss; silicon dioxide pillar matrix; silicon oxide (SilOx); temperature coefficient of frequency (TCF); temperature compensated crystal oscillator (TCXO); temperature compensation;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2270434
  • Filename
    6553603