Title :
New experimental approaches for the characterization of compliant press-fit pins in plated-through holes
Author :
Yost, B. ; Li, C.-Y. ; Brodsky, W.L. ; Pokrzywa, R.S.
Author_Institution :
Cornell Univ., Ithaca, NY, USA
Abstract :
New experimental approaches are demonstrated to reveal more detailed physical characteristics that govern the performance and reliability of compliant press-fit pin/plated through hole assemblies as compared to common methods involving peak insertion and withdrawal force measurements. These approaches include: (1) measurement of the withdrawal force-displacement profile with high-speed techniques. (2) microdisplacement tests involving displacement in the micron range, and (3) long-term cyclic microdisplacement tests in a controlled environment. The results of these tests provide, respectively, information on: (1) the withdrawl energy and contact area. (2) the stiffness of the assembly, which relates to bond strength and contact area, and (3), the effects of fretting from thermal displacement cycles
Keywords :
electric connectors; electrical contacts; environmental testing; life testing; printed circuit accessories; reliability; CPFP; PCB connectors; PTH; bond strength; characterization; compliant press-fit pins in plated-through holes; contact area; controlled environment; detailed physical characteristics; effects of fretting; experimental approaches; long-term cyclic microdisplacement tests; microdisplacement tests; performance; reliability; stiffness; thermal displacement cycles; withdrawal force-displacement profile; withdrawl energy; Assembly; Bonding; Contacts; Copper alloys; Electronic equipment testing; Force measurement; Manufacturing; Pins; System testing; Temperature;
Conference_Titel :
Electrical Contacts, 1990. Proceedings of the Thirty-Sixth IEEE Holm Conference on ... and the Fifteenth International Conference on Electrical Contacts
Conference_Location :
Montreal, Que.
DOI :
10.1109/HOLM.1990.113065
