DocumentCode :
2678521
Title :
Low cost, high performance RF substrates
Author :
Santhanam, N.
fYear :
1999
fDate :
21-24 Feb. 1999
Firstpage :
65
Lastpage :
68
Abstract :
In the past 50 years, as the lower frequency bands in the electromagnetic spectrum have been rapidly used, the common frequencies for wireless applications have increased from 500 MHz to 77 GHz+. Also, in the last decade, the market has moved from a predominately military market, to a 100% consumer-driven market. These factors, in conjunction with several more wireless applications in a competitive marketplace, have created the need to reduce the cost of all components. One area of focus is the laminate cost, and the cost of PCB (printed circuit board) fabrication. Designers and laminate manufacturers, in collaboration with several resins manufacturers, have been experimenting with, and designing various substrates to reduce the overall cost. These designers and manufacturers have had limited success, and have constantly run into deficiencies. This paper looks at some of the deficiencies, and some of the myths, and attempts to answer the question: "is there is really a true low-cost, microwave and RF substrate?".
Keywords :
microwave materials; polymers; printed circuit manufacture; substrates; PCB fabrication; PTFE; components costs reduction; consumer-driven market; electromagnetic spectrum; high performance RF substrates; laminate cost; laminate manufacturers; low cost RF substrates; military market; printed circuit board; resins manufacturers; wireless applications; Costs; Defense industry; Dielectric substrates; Flame retardants; Frequency conversion; Laminates; Manufacturing; Personal communication networks; Radio frequency; Resins;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Technologies for Wireless Applications, 1999. Digest. 1999 IEEE MTT-S Symposium on
Conference_Location :
Vancouver, BC, Canada
Print_ISBN :
0-7803-5152-5
Type :
conf
DOI :
10.1109/MTTTWA.1999.755130
Filename :
755130
Link To Document :
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