• DocumentCode
    267902
  • Title

    Composite of thermally responsive solution and lubricating micro beads as sealing material for piston-cylinder actuator

  • Author

    Chishiro, T. ; Honda, Shogo ; Konishi, Satoshi

  • Author_Institution
    Ritsumeikan Univ., Kusatsu, Japan
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    592
  • Lastpage
    595
  • Abstract
    In this paper, we propose a novel sealing technique for a piston-cylinder actuator. Pneumatic actuators, especially piston-cylinder actuators are attractive in MEMS field because of its high force density. The sliding part of the piston actuator requires both high sealing and excellent lubrication. We reported parylene deposition of a piston rod to improve sealing. In contrast, this paper presents a smart sealing material composed of thermally responsive solution and lubricating micro beads. Micro beads contributed to provide lubricant between a sliding part and an inner wall when thermally responsive solution gels by heating. Heated composite of thermally responsive solution and micro beads gels around a piston rod while the composite works as pressuring liquid in the region without heating. We evaluate piston cylinder of restriction force, pressure resistance, and force. We observe inside of piston cylinder actuator to understand detail phenomenon. Piston actuator is integrated with a heater.
  • Keywords
    lubrication; microactuators; micromachining; pistons; pneumatic actuators; sealing materials; MEMS field; heated composite; lubricating micro beads; parylene deposition; piston cylinder actuator; piston rod; pneumatic actuators; pressure resistance; restriction force; sliding part; smart sealing material; thermally responsive solution; Actuators; Force; Glass; Heating; Pistons; Seals; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765710
  • Filename
    6765710