DocumentCode :
267948
Title :
Out-of-plane micro triple-hot-wire anemometer based on Pyrex bubble for airflow sensing
Author :
Shuwei Liu ; Shanshan Pan ; Fei Xue ; Nay Lin ; Haobin Liu ; Jianmin Miao ; Norford, Leslie K. ; Lim, H.B.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear :
2014
fDate :
26-30 Jan. 2014
Firstpage :
777
Lastpage :
780
Abstract :
The paper reports novel design and fabrication of out-of-plane micro airflow sensors based on the hot-wire sensing principle, i.e. gas cooling of electrically-heated wires. Three micro Ti/Au/Cu hot-wire resistors have been fabricated on an out-of-plane Pyrex bubble with height of 300 μm. They are arranged 120 degrees apart on the sidewall of a bubble at height of 100 μm for airflow velocity and direction detection. Air velocity around the out-of-plane bubble structure has been investigated for square and circular package designs. The sensor with axisymmetric circular package has demonstrated the ability to detect velocity (<;10 m/s) and to determine flow direction with an error less than ±8° when the velocity is 10m/s. The sensitivity could be further improved in a new design with increased bubble height (1 mm) and elevated hot-wire resistor position (500 μm), according to the modeling results.
Keywords :
anemometers; bubbles; flow measurement; flow sensors; microfabrication; microsensors; packaging; resistors; two-phase flow; wires (electric); Ti-Au-Cu; airflow velocity; axisymmetric circular package; electrically heated wires; elevated hot wire resistor; flow direction detection; gas cooling; hot wire sensing principle; micro hot wire resistors fabrication; out-of-plane Pyrex bubble; out-of-plane bubble structure; out-of-plane micro airflow sensor fabrication; out-of-plane micro airflow sensors design; out-of-plane micro triple-hot wire anemometer; size 100 mum; size 300 mum; square package design; Atmospheric modeling; Fluid flow measurement; Resistors; Sensor phenomena and characterization; Thermal sensors; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/MEMSYS.2014.6765756
Filename :
6765756
Link To Document :
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