DocumentCode :
2679876
Title :
CVD process for copper interconnection
Author :
Marcada, C. ; Richard, E. ; Torres, J. ; Palleau, J. ; Madar, R.
Author_Institution :
France Telecom, CNET
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
15
Lastpage :
17
Keywords :
Adhesives; Chemical technology; Copper; Electric resistance; Frequency; Metallization; Morphology; Reproducibility of results; Telecommunications; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887495
Filename :
887495
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2679876
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