DocumentCode :
2679893
Title :
Copper metallization for advanced ULSI devices using spray electroless plating technology
Author :
Nguyen, V.T.
Author_Institution :
FSI International
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
18
Lastpage :
19
Keywords :
Chemical vapor deposition; Conductivity; Copper; Delay effects; Inorganic materials; Integrated circuit interconnections; Metallization; Semiconductor materials; Spraying; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887496
Filename :
887496
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2679893
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