Fabrication of high aspect ratio insulating nozzle using glass reflow process and its electrohydrodynamic printing characteristics

Author

Kyoung Il Lee ; Byungjik Lim ; Se Wook Oh ; Seong Hyun Kim ; Churl Seung Lee ; Jin Woo Cho ; Yongtaek Hong

Author_Institution

Korea Electron. Technol. Inst., Seongnam, South Korea

fYear

2014

fDate

26-30 Jan. 2014

Firstpage

963

Lastpage

966

Abstract

We apply a glass reflow process to fabricate tiny glass nozzles with inner diameter of 20 microns and with a height of 150 microns which is impossible to achieve with a conventional etching process. Due to the enhanced aspect ratio of the nozzle, we observe better printing performances such as narrow line width below 10 microns and anti-wetting of ink around a nozzle. High frequency drop jetting up to 10 kHz is observed by applying high voltage pulse signals on ink inside the nozzle. Silver particle ink is also printed well and continuous line patterns are fabricated.

Keywords

electrohydrodynamics; glass; ink jet printing; insulating materials; nozzles; reflow soldering; continuous line patterns; electrohydrodynamic printing characteristics; etching process; glass reflow process; high aspect ratio insulating nozzle fabrication; high frequency drop; high voltage pulse signals; ink anti-wetting; inkjet printing technology; silver particle ink; size 20 micron; tiny glass nozzles; Etching; Fabrication; Glass; Ink; Printing; Silicon; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/MEMSYS.2014.6765803

Filename

6765803