Title :
Deposition of barrier layer and CVD copper under no exposed wafer conditions : adhesion performance and process integration
Author :
Braeckelmann, G. ; Manger, D. ; Seo, S.C. ; Beasor, S. ; Nifsten, S. ; Kaloyeros, A.E.
Author_Institution :
The University at Albany
Keywords :
Adhesives; Chemical vapor deposition; Conductivity; Copper; Filling; Inorganic materials; Metallization; Plasma measurements; Sputtering; Testing;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887500
