DocumentCode
2680337
Title
Total process of 0.18 and 0.25 /spl mu/m ohmic contacts
Author
Hara, T.
Author_Institution
Hosei University
fYear
1997
fDate
16-19 March 1997
Firstpage
108
Lastpage
109
Keywords
Collimators; Contact resistance; Inorganic materials; Metallization; Ohmic contacts; Semiconductor device modeling; Silicidation; Surface resistance; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887529
Filename
887529
Link To Document