• DocumentCode
    268174
  • Title

    Tool Condition Diagnosis With a Recipe-Independent Hierarchical Monitoring Scheme

  • Author

    Blue, Jakey ; Gleispach, D. ; Roussy, Agnès ; Scheibelhofer, P.

  • Author_Institution
    Dept. of Sci. of Fabrication & Logistics, Ecole Nat. Super. des Mines de St.-Etienne, Gardanne, France
  • Volume
    26
  • Issue
    1
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    82
  • Lastpage
    91
  • Abstract
    Tool condition evaluation and prognosis has been an arduous challenge in the modern semiconductor manufacturing environment. More and more embedded and external sensors are installed to capture the genuine tool status for fault identification. Therefore, tool condition analysis based on real-time equipment data becomes not only promising but also more complex with the rapidly increased number of sensors. In this paper, the idea of generalized moving variance (GMV) is employed to consolidate the pure variations within tool fault detection and classification data into one single indicator. A hierarchical monitoring scheme is developed to generate an overall tool indicator that can coherently be drilled down into the GMVs within functional sensor groups. Therefore, we will be able to classify excursions found in the overall tool condition into sensor groups and make tool fault detection and identification more efficient.
  • Keywords
    fault diagnosis; semiconductor device manufacture; sensors; GMV; classification data; embedded sensors; external sensors; fault detection; fault identification; functional sensor groups; generalized moving variance; realtime equipment data; recipe-independent hierarchical monitoring scheme; semiconductor manufacturing environment; tool condition diagnosis; tool condition prognosis; Control charts; Maintenance engineering; Manufacturing; Monitoring; Principal component analysis; Radio frequency; Sensors; Fault detection and classification (FDC); Hotelling\´s $T^{2}$ ; moving variance and covariance; tool condition diagnosis;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2012.2230279
  • Filename
    6363617