Title :
High performance optoelectronic packaging for 2.5 and 10 Gb/s laser modules
Author :
Sherry, William M. ; Gaebe, Carl ; Miller, Thomas J. ; Schweizer, Rudolph C.
Author_Institution :
Solid State Technol. Center, AT&T Bell Labs., Breinigsville, PA, USA
Abstract :
This paper reviews the challenges associated with developing robust and manufacturable designs for laser modules capable of intercity trunking at speeds up to 10 Gb/s. Results from electrical, thermal, and optical simulations are presented and verified experimentally. Trade-off issues resulting from conflicting performance requirements are also discussed. A sensitive technique for measuring submicron mechanical motions is described and applied to a critical subassembly. Finally, a novel optical design is proposed which compensates spherical aberrations while providing greater than 40 dB of optical isolation
Keywords :
semiconductor lasers; 10 Gbit/s; 2.5 Gbit/s; high performance packaging; laser modules; optoelectronic packaging; spherical aberration compensation; submicron mechanical motions; Fiber lasers; Laser modes; Lenses; Optical coupling; Optical design; Optical devices; Optical fiber devices; Optical fibers; Optical sensors; Packaging;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.517449
