DocumentCode :
2683341
Title :
Impact of inductance and routing orientation on timing performances of coupled interconnect lines
Author :
Deschacht, D.
Author_Institution :
Lab. d´´Inf., de Robot. et de Microelectron. de Montpellier LIRMM, Univ. Montpellier II, Montpellier, France
fYear :
2010
fDate :
23-25 March 2010
Firstpage :
1
Lastpage :
5
Abstract :
As the interconnect lines play an increasingly dominant role in determining circuit performance, the dynamic delay variation due to the switching activity of neighboring lines has to be accurately characterized. The goal of this work is to simulate the effect of inductance and routing orientation and then to investigate their effects on timing performances by considering three configurations of three parallel coupled interconnects. For a Deep-Sub-Micron process, we show that when analyzing VLSI circuits, if standard distributed RC models are used, and inductive effects and routing orientation are ignored, large errors can occur in the prediction and evaluation of the circuit behaviour. Both affect greatly circuit performances.
Keywords :
RC circuits; VLSI; integrated circuit interconnections; network routing; timing circuits; VLSI circuits; circuit behaviour; circuit performance; coupled interconnect lines; deep-sub-micron process; distributed RC models; dynamic delay variation; inductance; inductive effects; parallel coupled interconnects; routing orientation; switching activity; timing performances; Circuit analysis; Circuit optimization; Circuit simulation; Coupling circuits; Delay; Inductance; Integrated circuit interconnections; Routing; Switching circuits; Timing; VLSI interconnect; crosstalk; routing orientation; signal integrity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design and Technology of Integrated Systems in Nanoscale Era (DTIS), 2010 5th International Conference on
Conference_Location :
Hammamet
Print_ISBN :
978-1-4244-6338-1
Type :
conf
DOI :
10.1109/DTIS.2010.5487575
Filename :
5487575
Link To Document :
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