DocumentCode
2686909
Title
Up date on cleanliness of electronic assemblies
Author
Lepagnol, Jean H.
Author_Institution
Alpha Metals, Noisy le Sec, France
fYear
1990
fDate
0-0 1990
Firstpage
395
Lastpage
404
Abstract
Various issues connected with the cleanliness conditions and cleaning of electronic assemblies are addressed. Presoldering and soldering procedures are examined. The cleaning operation is described. Methods for the technical assessment of cleanliness are discussed. They consist of measuring ionic contamination and measuring surface insulation resistance. Typical levels of cleanliness obtained with various types of fluxes and cleaning processes are tabulated. The cost of cleaning is considered.<>
Keywords
printed circuit manufacture; quality control; soldering; surface mount technology; assessment of cleanliness; cleaning of electronic assemblies; cleaning operation; cleaning processes; cleanliness conditions; cleanliness of electronic assemblies; cost of cleaning; measuring ionic contamination; measuring surface insulation resistance; presoldering procedures; soldering procedures; types of fluxes; Assembly; Chemical processes; Conductors; Insulation; Printed circuits; Production; Soldering; Surface cleaning; Surface contamination; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location
Baveno, Italy
Type
conf
DOI
10.1109/IEMT8.1990.171044
Filename
171044
Link To Document