• DocumentCode
    2687147
  • Title

    A study of fluid coolant with carbon nanotube suspension for microchannel coolers

  • Author

    Fan, Yi ; Fu, Yifeng ; Zhang, Yan ; Wang, Teng ; Wang, Xiaojing ; Cheng, Zhaonian ; Liu, Johan

  • Author_Institution
    SMIT Center, Shanghai Univ., Shanghai
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In this work, silicon microchannel coolers were made using the deep ion reactive etching (DIRE) technique. Stable and homogeneous carbon nanotube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing controllable flow, and a fan system for cooling the circular fluid. Beside the inlet and outlet of the test module, two thermocouples and pressure gauges were set up to measure the temperature and pressure of the fluids. The heat removal of the silicon microchannel cooler using different CNT volume fraction of suspension coolant was studied. The results show that the microchannel cooler with CNT suspension as coolant could strengthen the heat removal capability of microchannel cooler. In addition to heat transfer enhancement, the microchannel cooler with CNT suspension coolant did not produce extra pressure drop in the present study.
  • Keywords
    carbon nanotubes; coolants; elemental semiconductors; heat transfer; micromechanical devices; silicon; sputter etching; suspensions; thermocouples; C; Si; circular fluid; closed-loop cooling test system; deep ion reactive etching; fluid coolant; heat removal capability; heat transfer enhancement; homogeneous carbon nanotube suspension; silicon microchannel cooler; silicon microchannel coolers; suspension coolant; thermocouples; Carbon nanotubes; Coolants; Cooling; Etching; Fluid flow control; Microchannel; Silicon; System testing; Temperature control; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607042
  • Filename
    4607042