DocumentCode
2687147
Title
A study of fluid coolant with carbon nanotube suspension for microchannel coolers
Author
Fan, Yi ; Fu, Yifeng ; Zhang, Yan ; Wang, Teng ; Wang, Xiaojing ; Cheng, Zhaonian ; Liu, Johan
Author_Institution
SMIT Center, Shanghai Univ., Shanghai
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
5
Abstract
In this work, silicon microchannel coolers were made using the deep ion reactive etching (DIRE) technique. Stable and homogeneous carbon nanotube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing controllable flow, and a fan system for cooling the circular fluid. Beside the inlet and outlet of the test module, two thermocouples and pressure gauges were set up to measure the temperature and pressure of the fluids. The heat removal of the silicon microchannel cooler using different CNT volume fraction of suspension coolant was studied. The results show that the microchannel cooler with CNT suspension as coolant could strengthen the heat removal capability of microchannel cooler. In addition to heat transfer enhancement, the microchannel cooler with CNT suspension coolant did not produce extra pressure drop in the present study.
Keywords
carbon nanotubes; coolants; elemental semiconductors; heat transfer; micromechanical devices; silicon; sputter etching; suspensions; thermocouples; C; Si; circular fluid; closed-loop cooling test system; deep ion reactive etching; fluid coolant; heat removal capability; heat transfer enhancement; homogeneous carbon nanotube suspension; silicon microchannel cooler; silicon microchannel coolers; suspension coolant; thermocouples; Carbon nanotubes; Coolants; Cooling; Etching; Fluid flow control; Microchannel; Silicon; System testing; Temperature control; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4607042
Filename
4607042
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