Title :
A reliability investigation of MEMS transducers with comb structures
Author :
An, Ping ; He, Yandong ; Jin, Yufeng ; Hao, Yilong
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing
Abstract :
An overview of reliability investigation of micro electro mechanical system (MEMS) transducers with comb structures was presented. With the development of the MEMS industrialization, the reliability is underway to meet the need of market. To build a reliability research and develop platform, MEMS center of Peking University made its roadmap of a general developing plan. In this paper, the roadmap was presented and the short-term roadmap about failure analysis (FA) was illustrated. In addition, FA techniques of localization, characterization and sample preparation for MEMS were summarized. Finally, some FA cases of the center of PKU were discussed and a destructive physical analysis (DPA) case about the particle impact noise detection (PIND) was presented.
Keywords :
failure analysis; micromechanical devices; reliability; transducers; MEMS transducers; comb structures; electromechanical system; failure analysis; particle impact noise detection; reliability; Actuators; Consumer electronics; Costs; Failure analysis; Integrated circuit reliability; Laboratories; Microelectromechanical devices; Micromechanical devices; Stress; Transducers;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607044
