Title :
Moisture diffusion model verification of packaging materials
Author :
Ma, Xiaosong ; Jansen, K.M.B. ; Ernst, L.J. ; van Driel, W.D. ; van der Sluis, O. ; Zhang, G.Q. ; Regard, Charles ; Gautier, Christian ; Frémont, Hélène
Author_Institution :
Delft Univ. of Technol., Delft
Abstract :
The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.
Keywords :
delamination; electronics packaging; moisture; reflow soldering; electronic packaging; interfacial delamination; moisture absorption; moisture diffusion coefficient; moisture diffusion model verification; nonhermetic material; Absorption; Delamination; Electronics packaging; Humidity; Materials testing; Mechanical factors; Moisture; Polymers; Semiconductor device modeling; Temperature sensors;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607066
