• DocumentCode
    2688029
  • Title

    Parasitic extraction and performance evaluation of a high I/O package

  • Author

    Subramanian, Rajagopal ; Swaminathan, Madhavan ; Behar, Moises

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1998
  • fDate
    8-10 Dec 1998
  • Firstpage
    99
  • Lastpage
    106
  • Abstract
    This paper discusses the parasitic extraction of a high I/O package using TDR (time domain reflectometry) measurements. The package that was considered was the VSPA (very small peripheral array), a unique high I/O package due to the 3D structure of the package pins
  • Keywords
    integrated circuit interconnections; integrated circuit measurement; integrated circuit packaging; time-domain reflectometry; 3D package pin structure; TDR measurements; VSPA package; high I/O package; parasitic extraction; performance evaluation; time domain reflectometry; very small peripheral array package; Electronic packaging thermal management; Electronics packaging; Equivalent circuits; Frequency measurement; Magnetostatics; Pins; Printed circuits; Reflectometry; Thermal conductivity; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
  • Print_ISBN
    0-7803-5141-X
  • Type

    conf

  • DOI
    10.1109/EPTC.1998.755986
  • Filename
    755986
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2688029