Title :
Sensitivity study of temperature and strain rate dependent properties on solder joint fatigue life
Author :
Pang, H.L.J. ; Wang, Y.P. ; Shi, X.Q. ; Wang, Z.P.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
Tensile tests of 63Sn/37Pb solder were carried out at various strain rates over a wide range of temperatures to study the effect of strain rates and testing temperatures on the mechanical properties of solder. A statistical method incorporating multiple linear regression was also employed successfully and a set of empirical formulae was derived to describe the effects of temperature and strain rate quantitatively. These mechanical properties were applied to finite element analysis to study the sensitivity of these material properties on the fatigue life of solder joints in a plastic ball grid array (PBGA) package. From this study, the strain rate effect on solder response to different ramp rates during thermal cycling or thermal shock reliability tests can be modeled in finite element analysis
Keywords :
assembling; ball grid arrays; finite element analysis; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; lead alloys; plastic packaging; sensitivity; soldering; statistical analysis; tensile testing; thermal analysis; thermal shock; tin alloys; PBGA package; SnPb; SnPb solder; fatigue life; finite element analysis; material properties sensitivity; mechanical properties; multiple linear regression; plastic ball grid array package; ramp rates; sensitivity; solder joint fatigue life; solder joints; solder mechanical properties; solder model; solder response; statistical method; strain rate; strain rate dependent properties; temperature dependent properties; temperature effects; tensile tests; testing temperature; thermal cycling; thermal shock reliability tests; Capacitive sensors; Finite element methods; Linear regression; Mechanical factors; Statistical analysis; Temperature dependence; Temperature distribution; Temperature sensors; Tensile strain; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
Print_ISBN :
0-7803-5141-X
DOI :
10.1109/EPTC.1998.755999
