Title :
Optimization of the fatigue life of Epoxy Molding Compounds based on BP neural network prediction model
Author :
Miao Cai ; Dao-Guo Yang ; Quan-yong Li ; Li-jun Zhong
Author_Institution :
Sch. of Mech. Eng., Guilin Univ. of Electron. Technol., Guilin
Abstract :
Based on the data from the fatigue test of Epoxy Molding Compound (EMC), firstly with a focus on the application problem of the instability between fitting and prediction error of BP neural network (BPNN), the prediction model of fatigue life for EMC materials is established. In this approach, the network structure is improved with initiative way by reducing input from the perspective of nodes with principal component analysis (PCA). Secondly, in order to deal with the problem of the bottleneck in local flow minimum of BPNN, this study tries to find out the global minimum and improves the convergence performance of the BPNN combining genetic algorithm (GA). The stability and practicality of the GABPNN model is analyzed after training and verifying, and the effect of the input factors on the output factor is studied in turn. Finally, this paper makes use of well-trained GABPNN prediction model to analyze optimum design methods of parameters to predict the fatigue life. The prediction and optimization results show that the well-trained GABPNN model can be used in the forecasting and optimizing design of the fatigue and fracture reliability of the epoxy molding compounds, and is of much practical value.
Keywords :
backpropagation; fatigue; genetic algorithms; moulding; neural nets; principal component analysis; backpropagation; epoxy molding compounds; fatigue life; fracture reliability; genetic algorithm; neural network prediction model; principal component analysis; Convergence; Design optimization; Electromagnetic compatibility; Fatigue; Genetic algorithms; Life testing; Materials testing; Neural networks; Predictive models; Principal component analysis; BP neural network (BPNN); fatigue life; genetic algorithms (GA); optimization; principal component analysis (PCA); stability;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-2739-0
Electronic_ISBN :
978-1-4244-2740-6
DOI :
10.1109/ICEPT.2008.4607114