DocumentCode :
2692162
Title :
HangBot: A ceiling mobile robot with robust locomotion under a large payload (Key mechanisms integration and performance experiments)
Author :
Fukui, Rui ; Morishita, Hiroshi ; Mori, Taketoshi ; Sato, Tomomasa
Author_Institution :
Grad. Sch. of Inf. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan
fYear :
2011
fDate :
9-13 May 2011
Firstpage :
4601
Lastpage :
4607
Abstract :
This research aims to develop a ceiling mobile robot that can sustain a large payload and can locomote freely under a ceiling space. In our approach, a perforated metal, one of the recent popular architectural materials, is utilized as a ceiling plate and the robot hooks and hangs the sequential holes of the ceiling plate by mechanical constraint. To realize the robot, the authors developed three key mechanisms, (1) ceiling hanging mechanism for the perforated metal, (2) horizontal locomotion mechanism like an inchworm, and (3) pantograph mechanism for smoothing horizontal locomotion speed and for load balancing. A unit testing of the ceiling hanging mechanism and the integration horizontal locomotion experiments confirmed the good performance of each mechanisms and the feasibility of mechanically constrained ceiling mobile robot. However, it was revealed that higher power motors and a stiffer body structure should be installed to sustain an extremely large payload like a human.
Keywords :
ceilings; mobile robots; motion control; robust control; HangBot; architectural material; body structure; ceiling hanging mechanism; ceiling mobile robot; ceiling plate; horizontal locomotion mechanism; horizontal locomotion speed smoothing; inchworm; integration horizontal locomotion experiment; load balancing; mechanical constraint; pantograph mechanism; perforated metal; performance experiment; robot hook; robust locomotion; DC motors; Fasteners; Force; Metals; Mobile robots; Potentiometers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Robotics and Automation (ICRA), 2011 IEEE International Conference on
Conference_Location :
Shanghai
ISSN :
1050-4729
Print_ISBN :
978-1-61284-386-5
Type :
conf
DOI :
10.1109/ICRA.2011.5979851
Filename :
5979851
Link To Document :
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