• DocumentCode
    2693322
  • Title

    Low-voltage metal-gate top-contact organic thin-film transistors and complementary inverters with submicron channel length

  • Author

    Ante, F. ; Zschieschang, U. ; Weitz, R.T. ; Kalblein, D. ; Kern, K. ; Klauk, H.

  • Author_Institution
    Max Planck Inst. for Solid State Res., Stuttgart, Germany
  • fYear
    2009
  • fDate
    22-24 June 2009
  • Firstpage
    179
  • Lastpage
    180
  • Abstract
    Since the mobility of organic semiconductors cannot be increased indefinitely , improvements in the dynamic performance of organic thin-film transistors (TFTs) require reductions in the TFT dimensions. Assuming a mobility of 0.1 cm2/Vs and aiming for a cutoff frequency of 10 MHz at 3 V, channel length and gate-to-contact overlap have to be reduced well below 1 ¿m. Although no cost-effective methods to manufacture high-mobility submicron organic TFTs on large-area flexible substrates currently exist, such methods may become available in the near future. To ensure that the carrier density in short-channel TFTs is controlled by the gate, rather than the drain, the gate dielectric thickness must also be reduced, ideally using a low-temperature-processable dielectric and without introducing large gate leakage.
  • Keywords
    organic semiconductors; thin film transistors; carrier density; complementary inverters; gate dielectric thickness; gate-to-contact overlap; high-mobility submicron organic TFT; large gate leakage; low-temperature-processable dielectric; metal-gate top-contact organic thin film transistors; organic semiconductors; submicron channel length; Charge carrier density; Cutoff frequency; Dielectric substrates; Flexible manufacturing systems; Gate leakage; Inverters; Organic semiconductors; Organic thin film transistors; Thickness control; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2009. DRC 2009
  • Conference_Location
    University Park, PA
  • Print_ISBN
    978-1-4244-3528-9
  • Electronic_ISBN
    978-1-4244-3527-2
  • Type

    conf

  • DOI
    10.1109/DRC.2009.5354939
  • Filename
    5354939