DocumentCode :
2693845
Title :
Multi chip modules for telecom applications
Author :
Gustafsson, Kåre ; Flodman, Göran
Author_Institution :
Ericsson Telecom, Stockholm, Sweden
fYear :
1990
fDate :
0-0 1990
Firstpage :
43
Lastpage :
52
Abstract :
It is pointed out that the telecom system performance can be improved by the use of MCM (multichip modules) technology. Better signal transmission properties, lower power dissipation (if CMOS chips are used), and decreased physical volume will be obtained. Today MCM is an expensive technique, but a cost analysis shows that it has the potential of becoming more cost effective than the standard technique of using single-chip packages. It can also become more cost effective to use the MCM technique rather than increase the number of gates on the silicon chip over a certain level. In order to study the properties of the MCM technology, a project has been started at Ericsson Telecom in which a processor application is built up on three different types of MCM substrates.<>
Keywords :
hybrid integrated circuits; integrated circuit technology; modules; packaging; printed circuits; project engineering; telecommunication equipment; CMOS chips; Ericsson Telecom; MCM; PCB costs; multichip modules; project; signal transmission properties; telecom system performance; Capacitance; Conductors; Cost function; Delay estimation; Electronics packaging; Power dissipation; Signal design; System performance; Telecommunications; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990, IEMT Conference., 8th IEEE/CHMT International
Conference_Location :
Baveno, Italy
Type :
conf
DOI :
10.1109/IEMT8.1990.171088
Filename :
171088
Link To Document :
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