DocumentCode
2696089
Title
Boiling heat transfer from inclined channels in a natural circulation loop
Author
Cho, Chang Hyun ; Lee, Sang R. ; Seong, Hyung J.
Author_Institution
Headquarter of Res. & Dev., Korea Acad. of Ind. Technol., Seoul, South Korea
fYear
1990
fDate
23-25 May 1990
Firstpage
86
Lastpage
89
Abstract
Boiling heat transfer was investigated in a rectangular channel heated from the bottom and inclined at 30° to the horizontal. The channel is installed in a two-phase closed thermosyphon loop where water is circulated naturally. One of the experimental parameters is heat flux (16.10, 13.82, and 9.09 W/cm2) from the immersed heater surface, and the other is channel spacing in the range of 1-20 mm between the adiabatic upper wall and the heated bottom wall. At constant imposed heat flux, the superheat at the wetted heater surface declined as the channel spacing narrowed from about 10 mm to 1 mm and was in inverse proportion to the average mass velocity through the channel. The heat transfer coefficient at the immersed surface of heater increased as the average mass velocity increased. On the other hand, in the slower mass velocity region, the heat transfer coefficient at the higher heat flux was larger than that at the lower one, but this trend was reversed in the faster mass velocity region. The turning point was about 90 g/cm 2 s. These data are applicable to actual cooling system designs for multilayer printed circuit boards where guide vanes are attached to the inlet of each channel
Keywords
boiling; cooling; heat transfer; packaging; printed circuits; 1 to 20 mm; adiabatic upper wall; boiling heat transfer; channel spacing; cooling system designs; experimental parameters; guide vanes; heat flux; heat transfer coefficient; heated bottom wall; immersed heater surface; inclined channels; mass velocity; multilayer printed circuit boards; natural circulation loop; rectangular channel heated from bottom; two-phase closed thermosyphon loop; Channel spacing; Circuits; Electronics cooling; Heat engines; Heat transfer; Immersion cooling; Mechanical engineering; Microelectronics; Packaging; Temperature control;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ITHERM.1990.113315
Filename
113315
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