DocumentCode :
2698651
Title :
A new caged structure spin-on-silica for multilevel interconnect application
Author :
Pineda, Raymond ; Chiang, Chien ; Fraser, David B.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fYear :
1990
fDate :
12-13 Jun 1990
Firstpage :
180
Lastpage :
186
Abstract :
A unique, carbon-free silica material, based on a new concept of converting caged (HSiO3/2)n structures by eliminating the hydrogens and cross-linking the caged structures with oxygen, was characterized for ILD (interlayer dielectric) applications. The films show excellent uniformity as well as good planarity. At temperatures below 600°C, no volume shrinkage is observed. However, above this temperature, volume losses of as much as 30% can be observed. FTIR (Fourier transform infrared) spectroscopy data and film stress measurements (used to determining film stability) show that a stable crack-free oxide (SiO2) can be obtained with a high-temperature oven bake or with an optimized process combining low-temperature oven baking and exposure to oxygen plasma. These early results show that this spin-on-silica precursor is suitable for nonetchback processes such as those that involve oxide deposition between polysilicon and the first level of metal. With processing improvements at lower temperatures, the precursor also shows promise for intermetal oxide applications
Keywords :
dielectric thin films; integrated circuit technology; internal stresses; metallisation; silicon compounds; spectrochemical analysis; 600 degC; FTIR spectroscopy; SiO2; caged structure; crack-free oxide; cross-linking; film stability; film stress; high-temperature oven bake; interlayer dielectric; intermetal oxide; low-temperature oven baking; multilevel interconnect; nonetchback processes; oxide deposition; planarity; plasma exposure; polysilicon; spin-on-film; uniformity; volume shrinkage; Dielectric materials; Fourier transforms; Hydrogen; Infrared spectra; Organic materials; Ovens; Plasma stability; Plasma temperature; Silicon compounds; Spectroscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE
Conference_Location :
Santa Clara, CA
Type :
conf
DOI :
10.1109/VMIC.1990.127863
Filename :
127863
Link To Document :
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