DocumentCode :
2700341
Title :
[Copyright notice]
fYear :
2010
fDate :
2-6 May 2010
Firstpage :
1
Lastpage :
1
Abstract :
The following topics are dealt with: MOSFET; hot carriers; nanoelectronics; compound semiconductors; manufacturing reliability; high voltage devices; microelectronic systems; MEMS; failure analysis; thin film devices; device dielectric breakdown; electronics packaging; ESD; photovoltaic devices; integrated circuit interconnection; BEOL dielectrics; flash memory; and circuit reliability.
Keywords :
MOSFET; circuit reliability; electric breakdown; electronics packaging; electrostatic discharge; failure analysis; flash memories; integrated circuit interconnections; integrated circuit manufacture; micromechanical devices; nanoelectronics; thin film devices; BEOL dielectrics; ESD; MEMS; MOSFET; circuit reliability; compound semiconductors; device dielectric breakdown; electronics packaging; failure analysis; flash memory; high voltage devices; hot carriers; integrated circuit interconnection; manufacturing reliability; microelectronic systems; nanoelectronics; photovoltaic devices; thin film devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2010 IEEE International
Conference_Location :
Anaheim, CA
ISSN :
1541-7026
Print_ISBN :
978-1-4244-5430-3
Type :
conf
DOI :
10.1109/IRPS.2010.5488868
Filename :
5488868
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2700341
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