Title :
Status of Technology Development for Plasma Facing Components
Author_Institution :
Sandia National Laboratory MS-1 129, P.O. BOX 5800 Albuquerque, NM 87185
Keywords :
Conducting materials; Copper; Heat sinks; Laboratories; Plasma materials processing; Plasma temperature; Plasma transport processes; Thermal conductivity; Thermal stresses; Water heating;
Conference_Titel :
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-3547-3
DOI :
10.1109/IECEC.1996.561188
