Title :
Electrically anisotropic conductive adhesives: a new model for conduction mechanism
Author :
Shi, Frank G. ; Abdullah, Mikrajuddin ; Chungpaiboonpatana, S. ; Okuyama, Kikuo ; Davidson, Craig ; Adams, Joseph M.
Author_Institution :
Sch. of Eng., California Univ., Irvine, CA, USA
Abstract :
A new model for the force-resistance relationship for anisotropic conductive adhesives is introduced by considering for the first time the effect of metal particle size distribution. It is shown that there is a universal power-law relationship between the applied force and the resistance of anisotropic ECAs. The theoretical predictions are found to be fully supported by experimental observations
Keywords :
adhesives; conducting polymers; electric resistance; electrical conductivity; filled polymers; packaging; particle size; anisotropic ECAs; anisotropic conductive adhesives; applied force; conduction mechanism model; electrically anisotropic conductive adhesives; force-resistance relationship; metal particle size distribution effect; resistance; universal power-law relationship; Anisotropic magnetoresistance; Conducting materials; Conductive adhesives; Contact resistance; Electronics industry; Packaging; Power engineering and energy; Power system modeling; Shape; Tunneling;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-56-4
DOI :
10.1109/ISAPM.1999.757305
