In situ observations of micromechanical behaviors of intermetallic compounds for structural applications in 3D IC micro joints

Author

Yu, J.J. ; Wu, J.Y. ; Yu, L.J. ; Kao, C.R.

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Taiwan Univ., Taipei, Taiwan

fYear

2015

fDate

14-17 April 2015

Firstpage

838

Lastpage

841

Abstract

For 3D IC application, solder volume in micro joint is much smaller than in the conventional joint. IMCs can easily occupied micro joints and dominate the properties of micro joint. Thus, it is anticipated that IMCs are to be used as structural materials in commercial scale in a few years. However, mechanical property data for reliability modelling are lacking. To characterize mechanical properties of IMCs becomes an urgent issue. In this study, we investigated the micromechanical behaviors of single crystalline IMCs generally formed in micro joints. Testing structures were produced by focused ion beam machining and subsequently tested by picoindenter in SEM which can simultaneously observe the sequence of failure of test structure. Our results are helpful on understanding the fracture modelling of IMCs.

Keywords

alloys; ion beams; machining; mechanical properties; micromechanical devices; scanning electron microscopy; semiconductor device reliability; solders; three-dimensional integrated circuits; 3D IC micro joint applications; SEM; fracture modelling; in situ observations; intermetallic compounds; ion beam machining; mechanical property data; micromechanical behaviors; picoindenter; reliability modelling; single crystalline IMC; solder volume; structural applications; structural materials; testing structures; Integrated circuits; Joints; Strain; Stress; Testing; Three-dimensional displays; 3D IC; Cu6Sn5; focus ion beam; micropillar compression; rystallographic orientation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on

Conference_Location

Kyoto

Print_ISBN

978-4-9040-9012-1

Type

conf

DOI

10.1109/ICEP-IAAC.2015.7111129

Filename

7111129