Title :
Simulation of three-dimensional wirebond deformation during transfer molding
Author :
Tay, A.A.O. ; Yeo, K.S. ; Wu, J.H.
Author_Institution :
Centre for IC failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore
Abstract :
During the transfer molding process, flow induced forces act on the wirebonds causing them to deform. If the deformation is excessive, package failure may arise. This paper describes the computer simulation of three-dimensional wirebond deformation using a boundary integral method. The accuracy of the method was verified by experiment. The method was then applied to a case study involving a 25-leaded IC package
Keywords :
boundary integral equations; digital simulation; failure analysis; integrated circuit packaging; lead bonding; plastic packaging; IC package; boundary integral method; computer simulation; flow induced forces; package failure; three-dimensional wirebond deformation; transfer molding; Bonding forces; Creep; Deformable models; Geometry; Integrated circuit packaging; Laplace equations; Predictive models; Solid modeling; Transfer molding; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517812
