DocumentCode
2704167
Title
Blending symbolic matrix and dimensional numerical simulation methodology for mechatronics systems
Author
Ewing, Robert L.
Author_Institution
Inst. of Technol., Wright-Patterson AFB, OH, USA
fYear
1999
fDate
4-6 Mar 1999
Firstpage
270
Lastpage
273
Abstract
The methodology for the integration of design domains towards the purpose of controlling dynamic mechatronics systems is the current challenge of the modern engineer. Scaling issues for both the mechanical and electrical parameters are critical to the successful design and implementation of a mechatronic system. In approaching the scaling design methodology for future submicron fabrication, new disciplines of symbolic matrix techniques and dimensional analysis must be developed and applied in the design of these mechatronics systems. This paper presents both an overview of the techniques and insight using computer aided design packages for the blending of symbolic matrix techniques using the admittance matrix created by SPICE and dimensional analysis using Buckingham´s Π parameters
Keywords
SPICE; electronic design automation; matrix algebra; mechatronics; micromechanical devices; numerical analysis; Buckingham´s II parameters; ELECTRICAL CIRCUIT; SPICE; admittance matrix; computer aided design; control; dimensional analysis; dimensional numerical simulation; dynamic mechatronics; integration of design domains; mechatronics; microfluidic device; scaling design; submicron fabrication; symbolic matrix; Admittance; Design engineering; Design methodology; Fabrication; Laboratories; Measurement units; Mechatronics; Numerical simulation; Packaging; SPICE;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI, 1999. Proceedings. Ninth Great Lakes Symposium on
Conference_Location
Ypsilanti, MI
ISSN
1066-1395
Print_ISBN
0-7695-0104-4
Type
conf
DOI
10.1109/GLSV.1999.757431
Filename
757431
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