Title :
Analysis of critical wiring structures using CAPCAL V1.3
Author :
Seidl, A. ; Seegebrecht, P. ; Schreil, M.
Author_Institution :
Fraunhofer Inst. fur Festkorpertechnol., Munchen, West Germany
Abstract :
Two basic features of modern VLSI technology necessitate the three-dimensional (3D) solution of electrical field problems: (1) the lateral feature size is of the same order of magnitude as typical layer thicknesses; and (2) increasing layout complexity gives rise to structures for which only a genuine 3D description is applicable. The package CAPCAL V1.3 constitutes an improved version of the program introduced by A. Seidl et al. (1988). A particular extension of V1.3 is the capability for resistance calculations. As examples of the application of CAPCAL, 3D analysis of nonplanar line crossings and contact hole resistance measurement are shown
Keywords :
VLSI; circuit analysis computing; integrated circuit technology; software packages; 3D analysis; 3D description; CAPCAL V1.3; VLSI technology; contact hole resistance; critical wiring structures; electrical field problems; nonplanar line crossings; resistance calculations; Capacitance; Circuit simulation; Circuit testing; Contact resistance; Electrical resistance measurement; Geometry; Periodic structures; Planarization; Wiring;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE
Conference_Location :
Santa Clara, CA
DOI :
10.1109/VMIC.1990.127912
