DocumentCode
2706110
Title
The influence of arc chamber wall material on arc gap dielectric recovery voltage
Author
Shea, John J.
Author_Institution
Cutler-Hammer Inc., Pittsburgh, PA, USA
fYear
2000
fDate
25-27 Sept. 2000
Firstpage
161
Lastpage
168
Abstract
The dielectric breakdown strength of an arcing contact gap after current zero was compared when using alumina, polyamide 6/6 (PA 6/6), and polyoxymethylene (POM) arc chamber wall materials. Plasma characteristics were obtained for each material by applying a reverse recovery voltage across the open contacts at a predetermined delay time after current zero. Ablation from each type of chamber wall material produced different plasma compositions, each with different recovery voltage, arc voltage, and pressure characteristics. Tests were performed for an arcing current of 12 kA/sub p/ for one half-cycle using symmetric AgW contacts. A thermal breakdown model along with an exponential curve fit to the measured results were used to obtain the initial hold-off voltage and plasma time constant for each material. PA 6/6 was the better arc chamber gassing material because of its faster time constant. Two types of breakdown mechanisms were identified: thermal and dielectric.
Keywords
ceramics; circuit breakers; circuit-breaking arcs; electric strength; electrical contacts; plasma production; plasma-wall interactions; polymers; thermal analysis; 12 kA; AgW; alumina arc chamber wall materials; arc chamber gassing material; arc chamber wall material; arc gap dielectric recovery voltage; arc voltage; arcing contact gap; arcing current; chamber wall material ablation; current zero; delay time; dielectric breakdown mechanism; dielectric breakdown strength; exponential curve fitting; initial hold-off voltage; open contacts; plasma characteristics; plasma composition; plasma time constant; polyamide 6/6 arc chamber wall materials; polyoxymethylene arc chamber wall materials; pressure characteristics; recovery voltage; reverse recovery voltage; symmetric AgW contacts; thermal breakdown mechanism; thermal breakdown model; time constant; Breakdown voltage; Composite materials; Delay effects; Dielectric breakdown; Dielectric materials; Performance evaluation; Plasma materials processing; Plasma measurements; Plasma properties; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 2000. Proceedings of the Forty-Sixth IEEE Holm Conference on
Conference_Location
Chicago, IL, USA
Print_ISBN
0-7803-5960-7
Type
conf
DOI
10.1109/HOLM.2000.889925
Filename
889925
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