Title :
Design of a LTCC package Antenna for 900MHz RFID chip application
Author :
Kim, Ho-Yong ; Lee, Hong-Min
Author_Institution :
Dept. of Electron. Eng., Kyonggi Univ.
Abstract :
This paper focuses on the package level antenna realization at low frequency band. The novel proposed package antenna size is 13 mm times 9 mm times 3.51 mm. This structure, which can be applicable RF-SoP (RF system on package), has very compact size. By controlling the low temperature co-fired ceramic (LTCC) processing errors, the proposed package antenna will be applied on the 900 MHz RFID communication system
Keywords :
UHF antennas; ball grid arrays; ceramic packaging; integrated circuit packaging; radiofrequency identification; 900 MHz; LTCC package antenna; RF system on package; RF-SoP; RFID chip application; RFID communication system; low temperature co-fired ceramic processing errors; package level antenna realization; radiofrequency identification; Antenna measurements; Ceramics; Conductors; Electronics packaging; Microstrip antennas; Radio frequency; Radiofrequency identification; Resonance; Resonant frequency; Scanning electron microscopy;
Conference_Titel :
Antennas and Propagation Society International Symposium 2006, IEEE
Conference_Location :
Albuquerque, NM
Print_ISBN :
1-4244-0123-2
DOI :
10.1109/APS.2006.1711598
