DocumentCode :
2707856
Title :
The importance of standardizing CDM ESD test head parameters to obtain data correlation
Author :
Henry, Leo G. ; Kelly, Mark A. ; Diep, Tom ; Barth, Jon
Author_Institution :
ESD/TLP Consulting, Fremont, CA, USA
fYear :
2000
fDate :
26-28 Sept. 2000
Firstpage :
72
Lastpage :
84
Abstract :
Parameters associated with an observed variation in charged device model (CDM) ESD waveforms are shown to be pogo pin diameter, pogo pin length, distance between ground plane and charge plate, verification module disk diameter, dielectric area, and ground plane size. The effects on resulting discharge waveforms and solutions for improvement of existing CDM standards are discussed.
Keywords :
dielectric thin films; electrostatic discharge; integrated circuit packaging; integrated circuit testing; standards; CDM ESD test head parameters; CDM ESD waveforms; CDM standards; charged device model ESD waveforms; data correlation; dielectric area; discharge waveforms; ground plane size; ground plane-charge plate distance; pogo pin diameter; pogo pin length; standardization; verification module disk diameter; Calibration; Capacitance; Delay; Dielectrics; Discrete event simulation; Electronic mail; Electrostatic discharge; Oscilloscopes; Testing; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-58537-018-5
Type :
conf
DOI :
10.1109/EOSESD.2000.890030
Filename :
890030
Link To Document :
بازگشت