The importance of standardizing CDM ESD test head parameters to obtain data correlation

Author

Henry, Leo G. ; Kelly, Mark A. ; Diep, Tom ; Barth, Jon

Author_Institution

ESD/TLP Consulting, Fremont, CA, USA

fYear

2000

fDate

26-28 Sept. 2000

Firstpage

72

Lastpage

84

Abstract

Parameters associated with an observed variation in charged device model (CDM) ESD waveforms are shown to be pogo pin diameter, pogo pin length, distance between ground plane and charge plate, verification module disk diameter, dielectric area, and ground plane size. The effects on resulting discharge waveforms and solutions for improvement of existing CDM standards are discussed.

Keywords

dielectric thin films; electrostatic discharge; integrated circuit packaging; integrated circuit testing; standards; CDM ESD test head parameters; CDM ESD waveforms; CDM standards; charged device model ESD waveforms; data correlation; dielectric area; discharge waveforms; ground plane size; ground plane-charge plate distance; pogo pin diameter; pogo pin length; standardization; verification module disk diameter; Calibration; Capacitance; Delay; Dielectrics; Discrete event simulation; Electronic mail; Electrostatic discharge; Oscilloscopes; Testing; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000

Conference_Location

Anaheim, CA, USA

Print_ISBN

1-58537-018-5

Type

conf

DOI

10.1109/EOSESD.2000.890030

Filename

890030