Title :
Mechanical and electrical properties of poly(ether ether ketone) (PEEK) with various conductive fillers
Author_Institution :
Entegris, Chaska, MN, USA
Abstract :
Conductive or static dissipative formulations of poly(etheretherketone) (PEEK) are used widely in the microelectronics industry where excellent temperature, chemical, and abrasion resistance are required (Campbell and Tan, 1997). Previous work on PEEK for electronics handling applications has focused on the contamination aspects of carbon (C) fiber compounds (Mikkelsen, 1996). This study compares the mechanical and electrical properties of PEEK compounds that contain a variety of conductive fillers: carbon fiber, carbon powder, and stainless steel fiber.
Keywords :
carbon fibre reinforced plastics; conducting polymers; electrostatic discharge; fibre reinforced composites; filled polymers; particle reinforced composites; plastic packaging; protection; wear resistance; C; C fiber compounds; PEEK; PEEK compounds; abrasion resistance; carbon fiber filler; carbon powder filler; chemical resistance; conductive fillers; conductive formulations; contamination; electrical properties; electronics handling applications; mechanical properties; microelectronics industry; poly(ether ether ketone); poly(etheretherketone); stainless steel fiber filler; static dissipative formulations; temperature resistance; Carbon compounds; Conductivity; Mechanical factors; Microelectronics; Pigmentation; Plastics; Powders; Steel; Temperature; Testing;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-58537-018-5
DOI :
10.1109/EOSESD.2000.890039
