DocumentCode
2708643
Title
ESD performance of bridge-resistance pressure diaphragm sensors
Author
Lei, Kuo-Lung ; Chu, Charles Y. ; Tseng, Justine Y. ; Chiang, Yuh-Min ; Young, Michael
Author_Institution
Adv. Custom Sensors Inc., Irvine, CA, USA
fYear
2000
fDate
26-28 Sept. 2000
Firstpage
413
Lastpage
419
Abstract
The ESD performance of bridge-resistance based pressure diaphragm sensors, including micromachined silicon sensors and high-performance thin film sensors, is evaluated based on sensor span and offset as failure criteria. Different micromachined silicon sensors from different vendors show considerable differences in ESD performance. It is found that sensing element construction and layout contributes significantly to sensor ESD robustness. An incoming qualifying procedure is also developed to further help sensor application companies to screen sensing elements from different vendors. In addition, weak spots in current design are also identified.
Keywords
bridge circuits; diaphragms; electric resistance; electric sensing devices; electrostatic discharge; elemental semiconductors; failure analysis; micromachining; microsensors; pressure sensors; semiconductor device reliability; silicon; ESD performance; Si; bridge-resistance based pressure diaphragm sensors; bridge-resistance pressure diaphragm sensors; design weaknesses; failure criteria; micromachined silicon sensors; qualifying procedure; sensing element construction; sensing element layout; sensing element screening; sensor ESD robustness; sensor offset; sensor span; thin film sensors; Electrostatic discharge; Mechanical sensors; Piezoresistance; Resistors; Robustness; Semiconductor thin films; Silicon; Stress measurement; Tensile stress; Thin film sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000
Conference_Location
Anaheim, CA, USA
Print_ISBN
1-58537-018-5
Type
conf
DOI
10.1109/EOSESD.2000.890110
Filename
890110
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