Title :
1990 Proceedings. Seventh International IEEE VLSI Multilevel Interconnection Conference (Cat. No.90TH0325-1)
Abstract :
The following topics are dealt with: complete process realization; reliability; issues; dielectric systems; test structures and modeling; conductor systems; planarization processes; and contact and via filling
Keywords :
VLSI; dielectric thin films; integrated circuit technology; metallisation; reliability; VLSI multilevel interconnection; conductor systems; contact filling; dielectric systems; metallization; modeling; planarization processes; process realization; reliability; test structures; via filling;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE
Conference_Location :
Santa Clara, CA, USA
DOI :
10.1109/VMIC.1990.127940
