Integrated Micro Coaxial Air-Lines with Perforations

Author

Natarajan, Saravana P. ; Weller, Thomas M. ; Hoff, Andrew M.

Author_Institution

Dept. of Electr. Eng., South Florida Univ., Tampa, FL

fYear

2006

fDate

11-16 June 2006

Firstpage

424

Lastpage

427

Abstract

Three-dimensional micro coaxial transmission lines have been fabricated and measured on CMOS grade silicon wafers. One of the unique features of the structure is the perforated, coral-like outer shield and signal line which provides a means to control characteristic impedance and facilitates sacrificial layer removal after multi-layer deposition. These lines can thus be used to realize multilayer vertical interconnects with embedded MEMS devices for RF to mm-wave frequencies. Measured S-parameters through 40 GHz for lines of varying impedance and perforation density are presented

Keywords

CMOS integrated circuits; S-parameters; coaxial cables; coplanar waveguides; integrated circuit interconnections; micromechanical devices; microstrip lines; silicon; transmission lines; 3D microcoaxial transmission lines; 40 GHz; CMOS grade silicon wafers; MEMS devices; S-parameters; characteristic impedance; microcoaxial air-lines; multilayer deposition; multilayer vertical interconnects; perforation density; sacrificial layer removal; Coaxial components; Conductors; Dielectric losses; Dielectric substrates; Dielectric thin films; Distributed parameter circuits; Impedance; Microstrip; Polyimides; Radio frequency; MEMS transmission lines; interconnects; micro coaxial; suspended transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2006. IEEE MTT-S International

Conference_Location

San Francisco, CA

ISSN

0149-645X

Print_ISBN

0-7803-9541-7

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2006.249581

Filename

4014922