DocumentCode :
2712160
Title :
Anisotropic effect when using isotropic conductive adhesives
Author :
Felba, Jan ; Moscicki, A. ; Bereski, Marcin
fYear :
2004
fDate :
12-15 Sept. 2004
Firstpage :
33
Lastpage :
37
Keywords :
Anisotropic magnetoresistance; Conducting materials; Conductive adhesives; Conductivity; Dielectric materials; Electronics packaging; Flip chip; Isolation technology; Shape; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
Type :
conf
DOI :
10.1109/POLYTR.2004.1402736
Filename :
1402736
Link To Document :
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