Title :
Anisotropic effect when using isotropic conductive adhesives
Author :
Felba, Jan ; Moscicki, A. ; Bereski, Marcin
Keywords :
Anisotropic magnetoresistance; Conducting materials; Conductive adhesives; Conductivity; Dielectric materials; Electronics packaging; Flip chip; Isolation technology; Shape; Testing;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402736