DocumentCode :
2712209
Title :
Conductiveadhesives containing Ag-Sn alloys as conductive filler
Author :
Suzuki, Kenichi ; Shirai, Yukio ; Mizumura, Noritsuka ; Komagata, Michinon
fYear :
2004
fDate :
12-15 Sept. 2004
Firstpage :
57
Lastpage :
62
Keywords :
Adhesives; Contact resistance; Copper; Electrical resistance measurement; Integrated circuit interconnections; Resistors; Semiconductor device measurement; Silver; Testing; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
Type :
conf
DOI :
10.1109/POLYTR.2004.1402739
Filename :
1402739
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2712209
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