DocumentCode :
2712813
Title :
DC-50 GHz Low Loss Thermally Enhanced Low Cost LCP Package Process Utilizing Micro Via Technology
Author :
Aboush, Z. ; Benedikt, J. ; Priday, J. ; Tasker, P.J.
Author_Institution :
Sch. of Eng., Cardiff Univ.
fYear :
2006
fDate :
11-16 June 2006
Firstpage :
961
Lastpage :
964
Abstract :
This paper describes the design, simulation and measurements of a novel 5times5mm2 surface mount liquid crystal polymer (LCP) package which uses micro vias as a means of signal transition. The new package offers excellent thermal dissipation due to a cavity for device mounting, hence, eliminating the need for thermal vias. For the package design a novel matching technique was developed to match the micro via to 50Omega transmission line. The novel design allowed for a broadband response with 0.3dB of insertion loss and 20dB return loss up to 50GHz. The package achieved 40dB of isolation (after bonding) for a 1.2mm MMIC gap. To obtain accurate package s-parameter measurements a 2-tier calibration procedure was deployed to rapidly extract the package response. Further developments utilizing the good thermal conductivity of the new package technology for high-power LDMOS devices are presented
Keywords :
MMIC; S-parameters; integrated circuit packaging; liquid crystal polymers; surface mount technology; thermal conductivity; 0 to 50 GHz; 0.3 dB; 20 dB; 50 ohm; LCP package process; MMIC; broadband communication; laser machining; microvia technology; s-parameter measurements; signal transition; surface mount liquid crystal polymer; thermal conductivity; thermal dissipation; thermal vias; transmission line; Bonding; Costs; Insertion loss; Liquid crystal polymers; MMICs; Packaging; Scattering parameters; Signal design; Thermal conductivity; Transmission line measurements; Broadband Communication; Calibration; Ceramics; Laser Machining; MMICs; Microstrip; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
ISSN :
0149-645X
Print_ISBN :
0-7803-9541-7
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2006.249877
Filename :
4015073
Link To Document :
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