DocumentCode
2712866
Title
Modeling of particle arrangement in an isotropically conductive adhesive joint
Author
Windlein, M. ; Nicolics, Johann
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
251
Lastpage
256
Keywords
Composite materials; Conducting materials; Conductive adhesives; Contacts; Electric resistance; Independent component analysis; Polymers; Probability; Solid modeling; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402770
Filename
1402770
Link To Document