DocumentCode :
2713162
Title :
Impact of process variability on BEOL TDDB lifetime model assessment
Author :
Croes, K. ; Kocaay, D. ; Ciofi, I. ; Bommels, J. ; Tokei, Zs
Author_Institution :
imec, Leuven, Belgium
fYear :
2015
fDate :
19-23 April 2015
Abstract :
We investigate the impact of process variability on BEOL TDDB lifetime model assessment. The change in functional form of TDDB lifetime plots due to line-to-line variability and line-edge-roughness has been quantified in the field range in which long term TDDB measurements have been obtained. We found that the Pearson R2, which is used as a measure of linearity of a lifetime plot, did not significantly change due to process variability. Where process variability has a significant effect on TDDB and needs to be taken into account during data analysis, our simulations suggest that it does not have an impact on BEOL TDDB lifetime model assessment. We propose that the conclusions from recent literature reports which point in the direction of a less conservative model compared to the √E-model are valid, although they do not take process variability into account during the data analysis.
Keywords :
data analysis; integrated circuit modelling; √E-model; BEOL TDDB lifetime model assessment; Pearson R2; TDDB measurement; data analysis; line-edge-roughness; line-to-line variability; process variability; Analytical models; Data models; Dielectric breakdown; Dielectrics; Physics; Reliability; BEOL; Lifetime model; TDDB;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium (IRPS), 2015 IEEE International
Conference_Location :
Monterey, CA
Type :
conf
DOI :
10.1109/IRPS.2015.7112777
Filename :
7112777
Link To Document :
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