DocumentCode :
2715382
Title :
MMIC and Module Design and Performance for Millimetric Transceiver Front-ends for Transport Applications
Author :
Powell, J.R. ; Munday, P.D. ; Tang, W. H A ; Hunt, R.C. ; Gunton, D.J.
Author_Institution :
QinetiQ Ltd, Malvern
fYear :
2006
fDate :
11-16 June 2006
Firstpage :
1497
Lastpage :
1500
Abstract :
Millimeter wave transceiver front-end modules have been made for use in high data rate telematics transceiver applications in the frequency band 63 to 64 GHz. The modules incorporate a highly integrated core-transceiver MMIC, fabricated using a commercially available production GaAs pHEMT technology, for up- and down- conversion, signal amplification and image rejection functions. Packaging technologies are identified to realise potential low cost production of the front-ends. Under the millimetric tansceivers for transport applications (MILTRANS) project, a consortium of UK organisations, this hardware has been used in a system demonstrator based on modulation schemes compliant with the IEEE 802.11a standard and using a custom antenna designed for vehicle-to-roadside and vehicle-to-vehicle communications. Front-end performance characteristics are reported together with initial system performance for a network of nodes operated in static and mobile configurations
Keywords :
HEMT integrated circuits; III-V semiconductors; MMIC; gallium arsenide; integrated circuit design; transceivers; 63 to 64 GHz; GaAs; IEEE 802.11a standard; MILTRANS; MMIC; antenna design; down-conversion; image rejection functions; millimeter wave transceiver front-end modules; millimetric tansceivers for transport applications project; millimetric transceiver front-ends; module design; pHEMT technology; packaging technologies; signal amplification; system demonstrator; telematics transceiver; up-conversion; vehicle-to-roadside communications; vehicle-to-vehicle communications; Frequency; Gallium arsenide; Image converters; MMICs; Millimeter wave technology; PHEMTs; Packaging; Production; Telematics; Transceivers; Integrated circuit packaging; MIMICs; Millimeter wave communications; Mobile communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
ISSN :
0149-645X
Print_ISBN :
0-7803-9541-7
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2006.249576
Filename :
4015217
Link To Document :
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