Title :
Miniaturized SiP supply board based on TPVD charge pump ICs for high-voltage biomedical applications
Author :
Saiz-Vela, Albert ; Mounaim, Faycal ; Miribel-Català, Pere ; Sawan, Mohamad ; Samitier, Josep
Author_Institution :
Smart Self-Powered Bio-Electron. Syst. Lab. (SiC-Bio Lab.), Univ. de Barcelona (UB), Barcelona, Spain
Abstract :
A miniaturized System-in-Package (SiP) high-voltage (HV) supply board (2.7 cm × 0.7cm) based on full-custom two-phase voltage doubler (TPVD) charge pump ICs connected in a 2-stage cascade configuration is presented. An accurate mathematical model has been used to set up and select the value of the charge pump IC design/application parameters in order to fullfil the output voltage and load current requirements. The model has been validated with two different HV integration technologies (I2T100 BCD 0.7 μm from ON semiconductor and 0.8 μm 5/20V CMOS-DMOS from DALSA semicoductor). The proposed HV supply board includes a skipping-based regulation system built with commercial discrete ICs that allows the generation of regulated fractional output voltage values different from the expected 2× factor per stage and improves the power efficiency of the whole system over a wide range of working loads (especially at lighter loads). Experimental results show that our system is capable to obtain different unregulated/regulated output voltages under several working load conditions ranging from 7.6 V @ 7.27 mA of load current (55.2 mW) to 12.98 V @ 150 μA (1.94 mW). The designed charge pump IC has been integrated using the high-voltage I2T100 0.7 μm BCD smart power technology.
Keywords :
biomedical electronics; charge pump circuits; system-in-package; BCD smart power technology; HV supply board; ON semiconductor; TPVD charge pump IC; current 150 muA; current 7.27 mA; full-custom two-phase voltage doubler charge pump IC; high-voltage biomedical application; miniaturized SiP high voltage supply board; power 55.2 mW to 1.94 mW; power efficiency; size 0.7 mum; size 0.8 mum; skipping-based regulation system; system-in-package; voltage 7.6 V to 12.98 V; Charge pumps; Data models; Integrated circuit modeling; Semiconductor device modeling; Switching circuits; Voltage control;
Conference_Titel :
New Circuits and Systems Conference (NEWCAS), 2011 IEEE 9th International
Conference_Location :
Bordeaux
Print_ISBN :
978-1-61284-135-9
DOI :
10.1109/NEWCAS.2011.5981332